| 公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
|---|---|---|---|---|---|---|
| 2008 | A non-fluorine mold release agent for Ni stamp in nanoimprint process | Tien-Li Chang; Jung-Chang Wang ; Chun-Chi Chen; Ya-Wei Lee; Ta-Hsin Chou | Microelectronic Engineering | 9 | ||
| 2014 | Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection | Rong-Tsu Wang; Ya-Wei Lee; Sih-Li Chen; Jung-Chang Wang | International Communications in Heat and Mass Transfer | 6 |
