| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2025/6/9 | Optimizing Adhesion and Thermal Properties of PBAT-Based Hot-Melt Adhesives via Tailored Side-Chain Architectures | Mao, Hsu-, I; Chan, Tzu-Hsien; Yen, Hao-Chen; Tsai, Wei-Chun; Lin, Shin-Ying; Wang, Chin-Yen; Lin, Yung-Kai ; Chen, Chin-Wen | JOURNAL OF APPLIED POLYMER SCIENCE |
