| 公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
|---|---|---|---|---|---|---|
| 2025/6/9 | Optimizing Adhesion and Thermal Properties of PBAT-Based Hot-Melt Adhesives via Tailored Side-Chain Architectures | Mao, Hsu-, I; Chan, Tzu-Hsien; Yen, Hao-Chen; Tsai, Wei-Chun; Lin, Shin-Ying; Wang, Chin-Yen; Lin, Yung-Kai ; Chen, Chin-Wen | JOURNAL OF APPLIED POLYMER SCIENCE |
