| Issue Date | Title | Author(s) | Source | WOS | Fulltext/Archive link |
| 2020 | The oxidation behavior of Ni2FeCoCrAlx high-entropy alloys in dry air | Wu Kai ; Cheng, F. P.; Lin, Y. R.; Chuang, C. W.; Huang, R. T.; Chen, D.; Kai, J. J.; Liu, C. T.; Wang, C. J. | Journal of Alloys and Compounds | 2 | |
| 2017 | Oxidation behavior of Ru–Al multilayer coatings | Zhi-Ting Zheng; Wu Kai ; Yu-Ren Huang; Yung-I Chen | Applied Surface Science | | |
| 2008 | Oxidation behavior of the (Cu78Y22)98Al2 bulk metallic glass containing Cu5Y-particle composite at 400–600 °C | Wu Kai ; Ho, T. H.; Jen, I. F.; Lee, P. Y.; Yang, Y. M.; Chin, T. S. | Intermetallics | | |
| 2018 | The oxidation behavior of the quinary FeCoNiCrSix high-entropy alloys | Wu Kai ; Cheng, F. P.; Liao, C. Y.; Li, C. C.; Kai, J. J.; Rong-Tan Huang | Materials Chemistry and Physics | | |
| 2014 | The oxidation behavior of three different zones of welded Incoloy 800H alloy | W.S. Chen; Wu Kai ; Leu-Wen Tsay ; J.J. Kai | Nuclear Engineering and Design | 14 | |
| 2023 | The oxidation behavior of Tix(AlCrNb)100-x light-weight medium-entropy alloys in dry air at 600-800 degrees C | Kai, W. ; Liao, C. C.; Yang, I. R.; Chu, C. I.; Liu, S. F.; Kai, J. J. | CORROSION SCIENCE | 0 | |
| 2022 | Oxidation behaviors and mechanical properties of L1(2)-strengthened high-entropy alloys at 700? | Liu, Shaofei; Kai, Wu ; Hou, Jinxiong; Zhao, Yilu; Li, Qian; Yang, Chin-hua; Yang, Tao; Kai, Ji-jung | CORROSION SCIENCE | 4 | |
| 2023 | The oxidation of an equimolar FeCoNiAl medium-entropy alloy at 900 °C in various oxygen pressures | Kai, Wu ; Yang, Yi-Rong; Yu, Wun-Jhen; Huang, Rong-Tan ; Liu, Shaofei; Kai, Ji-Jung | CORROSION SCIENCE | | |
| 2017 | A Polyoxoniobate-Polyoxovanadate Double-Anion Catalyst for Simultaneous Oxidative and Hydrolytic Decontamination of Chemical Warfare Agent Simulants | Wu Kai | Acta Physico-Chimica Sinica | | |
| 2010 | Relationship between gray matter volume and age in 274 healthy Japanese children applying voxel-based morphometric analysis | Taki, Y.; Hashizume, H.; Sassa, Y.; Takeuchi, H.; Wu Kai ; Nouchi, R.; Kotozaki, Y.; Asano, K.; Asano, M.; Fukuda, H.; Kawashima, R. | Neuroscience Research | | |
| 2013 | Seismic behavior of shallow foundations during major earthquakes and artificial symmetrical shakes based on a three-dimensional effective stress analysis | Wei, L. C.; Yi, L. H.; 開物 ; Tung-Chin, K. G.; Yang, C. B.; Kanti, P.; Shobha, C.; Shankar, G. | Disaster Advances | | |
| 2018 | Single-Layer Circularly Polarized Wide Band Reflectarray Antenna with High Aperture Efficiency | Da, X. Y.; Wu, J. L.; Jing, Z.; Lin, B. Q.; Wu Kai | International Journal of Antennas and Propagation | | |
| 2002 | Strain-rate effects on superplastic properties of coarse-grained iron aluminides: a microstructural examination | Chu, J. P.; Wu Kai ; Yasuda, H. Y.; Umakoshi, Y.; Inoue, K. | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing | | |
| 2001 | Sulfidation Behavior of Inconel 738 Superalloy at 500–900°C | Wu Kai ; Lee, C. H.; Lee, T. W.; Wu, C. H. | Oxidation of Metals | | |
| 2004 | The Sulfidation of Inconel 738 in H2/H2S/Ar Gas Mixture at 500–900°C | Wu Kai ; Lin, Y. T.; Yu, C. C.; Chen, P. C.; Wu, C. H. | Oxidation of Metals | | |
| 1998 | Superplastic deformation in coarse-grained Fe–27A1 alloys | J.P.Chu; I.M.Liu; J.H.Wu; Wu Kai ; J.Y.Wang; K.Inoue | Materials Science and Engineering: A | | |
| 2010 | The oxidation behavior of a Ti50Cu28Ni15Sn7 bulk metallic glass at 400-500 degrees C | Kao, P. C.; Chen, W. S.; Lin, C. L.; Xiao, Z. H.; Hsu, C. F.; Pee-Yew Lee ; Wu Kai | Journal of Alloys and Compounds | 8 | |
| 2017 | Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging | Lau, J. H.; Li, M.; Tian, D. W.; Fan, N.; Kuah, E.; Wu Kai ; Hao, J.; Cheung, Y. M.; Li, Z.; Tan, K. H.; Beica, R.; Taylor, T.; Ko, C. T.; Yang, H.; Chen, Y. H.; Lim, S. P.; Lee, N. C.; Ran, J.; Xi, C.; Wee, K. S.; Yong, Q. X. | Ieee Transactions on Components Packaging and Manufacturing Technology | | |
| 2018 | Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers | Lau, J. H.; Li, M.; Yang, L.; Xu, I.; Chen, T.; Chen, S.; Yong, Q. X.; Madhukumar, J. P.; Wu Kai ; Fan, N.; Kuah, E.; Li, Z.; Tan, K. H.; Bao, W.; Lim, S. P.; Beica, R.; Ko, C. T.; Xi, C. | Ieee Transactions on Components Packaging and Manufacturing Technology | | |
