| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2010 | Relationship between gray matter volume and age in 274 healthy Japanese children applying voxel-based morphometric analysis | Taki, Y.; Hashizume, H.; Sassa, Y.; Takeuchi, H.; Wu Kai ; Nouchi, R.; Kotozaki, Y.; Asano, K.; Asano, M.; Fukuda, H.; Kawashima, R. | Neuroscience Research | | | |
| 2013 | Seismic behavior of shallow foundations during major earthquakes and artificial symmetrical shakes based on a three-dimensional effective stress analysis | Wei, L. C.; Yi, L. H.; 開物 ; Tung-Chin, K. G.; Yang, C. B.; Kanti, P.; Shobha, C.; Shankar, G. | Disaster Advances | | | |
| 2018 | Single-Layer Circularly Polarized Wide Band Reflectarray Antenna with High Aperture Efficiency | Da, X. Y.; Wu, J. L.; Jing, Z.; Lin, B. Q.; Wu Kai | International Journal of Antennas and Propagation | | | |
| 2002 | Strain-rate effects on superplastic properties of coarse-grained iron aluminides: a microstructural examination | Chu, J. P.; Wu Kai ; Yasuda, H. Y.; Umakoshi, Y.; Inoue, K. | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing | | | |
| 2001 | Sulfidation Behavior of Inconel 738 Superalloy at 500–900°C | Wu Kai ; Lee, C. H.; Lee, T. W.; Wu, C. H. | Oxidation of Metals | | | |
| 2004 | The Sulfidation of Inconel 738 in H2/H2S/Ar Gas Mixture at 500–900°C | Wu Kai ; Lin, Y. T.; Yu, C. C.; Chen, P. C.; Wu, C. H. | Oxidation of Metals | | | |
| 1998 | Superplastic deformation in coarse-grained Fe–27A1 alloys | J.P.Chu; I.M.Liu; J.H.Wu; Wu Kai ; J.Y.Wang; K.Inoue | Materials Science and Engineering: A | | | |
| 2010 | The oxidation behavior of a Ti50Cu28Ni15Sn7 bulk metallic glass at 400-500 degrees C | Kao, P. C.; Chen, W. S.; Lin, C. L.; Xiao, Z. H.; Hsu, C. F.; Pee-Yew Lee ; Wu Kai | Journal of Alloys and Compounds | | 8 | |
| 2017 | Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging | Lau, J. H.; Li, M.; Tian, D. W.; Fan, N.; Kuah, E.; Wu Kai ; Hao, J.; Cheung, Y. M.; Li, Z.; Tan, K. H.; Beica, R.; Taylor, T.; Ko, C. T.; Yang, H.; Chen, Y. H.; Lim, S. P.; Lee, N. C.; Ran, J.; Xi, C.; Wee, K. S.; Yong, Q. X. | Ieee Transactions on Components Packaging and Manufacturing Technology | | | |
| 2018 | Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers | Lau, J. H.; Li, M.; Yang, L.; Xu, I.; Chen, T.; Chen, S.; Yong, Q. X.; Madhukumar, J. P.; Wu Kai ; Fan, N.; Kuah, E.; Li, Z.; Tan, K. H.; Bao, W.; Lim, S. P.; Beica, R.; Ko, C. T.; Xi, C. | Ieee Transactions on Components Packaging and Manufacturing Technology | | | |
