| Issue Date | Title | Author(s) | Source | WOS | Fulltext/Archive link |
| 2010 | The oxidation behavior of a Ti50Cu28Ni15Sn7 bulk metallic glass at 400-500 degrees C | Kao, P. C.; Chen, W. S.; Lin, C. L.; Xiao, Z. H.; Hsu, C. F.; Pee-Yew Lee ; Wu Kai | Journal of Alloys and Compounds | 8 | |
| 2017 | Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging | Lau, J. H.; Li, M.; Tian, D. W.; Fan, N.; Kuah, E.; Wu Kai ; Hao, J.; Cheung, Y. M.; Li, Z.; Tan, K. H.; Beica, R.; Taylor, T.; Ko, C. T.; Yang, H.; Chen, Y. H.; Lim, S. P.; Lee, N. C.; Ran, J.; Xi, C.; Wee, K. S.; Yong, Q. X. | Ieee Transactions on Components Packaging and Manufacturing Technology | | |
| 2018 | Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers | Lau, J. H.; Li, M.; Yang, L.; Xu, I.; Chen, T.; Chen, S.; Yong, Q. X.; Madhukumar, J. P.; Wu Kai ; Fan, N.; Kuah, E.; Li, Z.; Tan, K. H.; Bao, W.; Lim, S. P.; Beica, R.; Ko, C. T.; Xi, C. | Ieee Transactions on Components Packaging and Manufacturing Technology | | |
