| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2024/4/1 | Characteristics of negative creep aging and its microstructure-oriented tensile behavior | Hsu, Cheng -An; Gan, Neng-Hao; Chang, Hong -Yi; Wang, Shing-Hoa ; Tsao, Tzu-Ching; Yang, Jer-Ren; Chiu, Po -Han; Zheng, Xue-Qian; Lee, Yuan-Tzu | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | | | |
| 2022 | Effect of Cu Additions on the Evolution of Eta-prime Precipitates in Aged AA 7075 Al-Zn-Mg-Cu Alloys | Hsiao, Ting-Jung; Chiu, Po-Han; Tai, Cheng-Lin; Tsao, Tzu-Ching; Tseng, Chien-Yu; Lin, Yi-Xian; Chen, Hsueh-Ren; Chung, Tsai-Fu; Chen, Chih-Yuan; Wang, Shing-Hoa ; Yang, Jer-Ren | METALS | | 0 | |
| 2022 | Effect of Natural Ageing on Subsequent Artificial Ageing of AA7075 Aluminum Alloy | Tai, Cheng-Ling; Tai, Po-Jui; Hsiao, Ting-Jung; Chiu, Po-Han; Tseng, Chien-Yu; Tsao, Tzu-Ching; Chung, Tsai-Fu; Yang, Yo-Lun; Chen, Chih-Yuan; Wang, Shing-Hoa ; Yang, Jer-Ren | METALS | | 1 | |
| 2023/11/14 | Innovation in thermal cycling aging compared to isothermal aging for precipitation hardening stainless steel | Hsu, Cheng-An; Chiu, Po-Han; Chang, Hong-Yi; Wang, Shing-Hoa ; Tsao, Tzu-Ching; Yang, Jer-Ren; Lee, Yuan-Tzu | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | | | |
| 2022 | Investigation of Strain-Induced Precipitation of Niobium Carbide in Niobium Micro-Alloyed Steels at Elevated Temperatures | Tsao, Tzu-Ching; Chiu, Po-Han; Tseng, Chien-Yu; Tai, Cheng-Lin; Chen, Hsueh-Ren; Chung, Tsai-Fu; Chen, Chih-Yuan; Wang, Shing-Hoa ; Tsai, Yu-Ting; Yang, Jer-Ren | METALS | | 0 | |
| 2024/11/29 | Microstructure evolution and strain rate sensitivity of ductile Hf20Nb10Ti35Zr35 medium-entropy alloy after thermal cycling | Wang, Shing-Hoa ; Liu, Chia-Heng; Yeh, Jien-Wei; Tsao, Tzu-Ching; Li, Chia-Lin; Chang, Horng-Yi ; Yang, Jer-Ren; Hsueh, Chun-Hway; Chang, Liu-Wen; Zheng, Xue-Qian; Lee, Yuan-Tzu; Yang, Ya-Ching | JOURNAL OF ALLOYS AND COMPOUNDS | | | |
| 2022 | Verification of the ability of Cu to dissolve in BCC delta in a delta-gamma Solid Solution above 1200 degrees C and boosting delta nano-hardness in Cu-containing PHSS | Gan, Neng-Hao; Sun, Yi-Hsuan; Tsao, Tzu-Ching; Li, Chia-Lin; Liu, Jia-Heng; Yen, Hung-Wei; Hsueh, Chun-Hway; Yang, Jer-Ren; Wang, Shing-Hoa ; Yeh, Jien-Wei; Chang, Horng-Yi ; Hou, Wen-Hsing | SCRIPTA MATERIALIA | | 2 | |
