| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2016 | Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads | Lai, Yung-Hao; Chang, Yang-Lang; Fang, Jyh-Perng; Chang, Lena ; Kobayashi, Hirokazu | IEICE T FUND ELECTR |
