| Issue Date | Title | Author(s) | Source | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|
| 2022 | Thermomechanical Property Measurement of Flexible Transparent Conductive-Film Substrates Based on Whole Folding Test by Reflective- Type Common-Path Liquid-Crystal Modulating Interferometry | Wen, Bor-Jiunn ; Hsu, Jui-Jen | IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 0 |
