第 1 到 3 筆結果,共 3 筆。
公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 | |
---|---|---|---|---|---|---|
1 | 2014 | L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas | Jung-Chang Wang | Heat and Mass Transfer | 6 | |
2 | 2014 | Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection | Rong-Tsu Wang; Ya-Wei Lee; Sih-Li Chen; Jung-Chang Wang | International Communications in Heat and Mass Transfer | 6 | |
3 | 2014 | U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method | Jung-Chang Wang | Microelectronics Reliability | 23 |