第 1 到 5 筆結果,共 5 筆。
公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 | |
---|---|---|---|---|---|---|
1 | 2014 | L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas | Jung-Chang Wang | Heat and Mass Transfer | 6 | |
2 | 2014 | Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection | Rong-Tsu Wang; Ya-Wei Lee; Sih-Li Chen; Jung-Chang Wang | International Communications in Heat and Mass Transfer | 6 | |
3 | 2012 | 3-D numerical and experimental models for flat and embedded heat pipes applied in high-end VGA card cooling system | Jung-Chang Wang | International Communications in Heat and Mass Transfer | 10 | |
4 | 2012 | Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system | Rong-Tsu Wang; Jung-Chang Wang | International Communications in Heat and Mass Transfer | 8 | |
5 | 2008 | Heat pipe for cooling of electronic equipment | Yu-Wei Chang ; Chiao-Hung Cheng; Jung-Chang Wang ; Sih-Li Chen | Energy Conversion and Management | 82 |