公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 |
2022 | Effect of Dispersing Multiwalled Carbon Nanotubes and Graphene Nanoplatelets Hybrids in the Matrix on the Flexural Fatigue Properties of Carbon/Epoxy Composites | Jen, Yi-Ming ; Ni, Wei-Lun | POLYMERS | 1 | |
2006 | Effect of lid materials on the solder ball reliability of thermally enhanced flip-chip plastic ball grid array packages | Yi-Ming Jen ; Chien, H. H.; Lin, T. S.; Huang, S. H. | Fracture and Strength of Solids Vi, Pts 1 and 2 | | |
2006 | Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages | Yi-Ming Jen ; Fang, C. K.; Yeh, Y. H. | Ieee Transactions on Components and Packaging Technologies | | |
2014 | Effect of temperature on fatigue strength of carbon nanotube/epoxy composites | Yi-Ming Jen ; Huang, C. Y. | Journal of Composite Materials | | |
2009 | Effect of the amount of adhesive on the bending fatigue strength of adhesively bonded aluminum honeycomb sandwich beams | Yi-Ming Jen ; Ko, C. W.; Lin, H. B. | International Journal of Fatigue | | |
2009 | Effect of thickness of face sheet on the bending fatigue strength of aluminum honeycomb sandwich beams | Yi-Ming Jen ; Chang, L. Y. | Engineering Failure Analysis | | |
2008 | Evaluating bending fatigue strength of aluminum honeycomb sandwich beams using local parameters | Yi-Ming Jen ; Chang, L. Y. | International Journal of Fatigue | | |
1998 | Evaluation of cumulative fatigue lives under different biaxial loading mode sequences for notched specimens | Yip, M. C.; Yi-Ming Jen | Fracture and Strength of Solids, Pts 1 and 2: Pt 1: Fracture Mechanics of Materials; Pt 2: Behavior of Materials and Structure | | |
2010 | Evaluation of fatigue life of adhesively bonded aluminum single-lap joints using interfacial parameters | Yi-Ming Jen ; Ko, C. W. | International Journal of Fatigue | | |
2011 | Experimental investigation on the effect of tensile pre-strain on ratcheting behavior of 430 Stainless Steel under fully-reversed loading condition | Chiou, Y. C.; Wen-Kai Weng ; Yi-Ming Jen | Engineering Failure Analysis | | |
2013 | Fatigue characterization of acid-treated carbon nanotube/epoxy composites | Yi-Ming Jen ; Huang, C. Y. | Journal of Composite Materials | | |
2012 | Fatigue life evaluation of adhesively bonded scarf joints | Yi-Ming Jen | International Journal of Fatigue | | |
2011 | Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth | Chiou, Y. C.; Yi-Ming Jen ; Huang, S. H. | Microelectronics Reliability | | |
2011 | Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages | Yi-Ming Jen ; Chiou, Y. C.; Yu, C. L. | Engineering Failure Analysis | | |
2006 | Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages | Yi-Ming Jen ; Wu, Y. L.; Fang, C. K. | Microelectronics Reliability | | |
2021 | Improvement in Tensile Quasi-Static and Fatigue Properties of Carbon Fiber-Reinforced Epoxy Laminates with Matrices Modified by Carbon Nanotubes and Graphene Nanoplatelets Hybrid Nanofillers | Jen, Yi-Ming ; Huang, Yu-Ching | NANOMATERIALS | 5 | |
2016 | INFLUENCE OF SHOT-PEENING -INDUCED RESIDUAL STRESSES ON POST-NECKING BEHAVIOR OF TEMPERED ULTRAHIGH-STRENGTH LOW ALLOY 300M STEEL | Shing-Hoa Wang ; Lin, Y. C.; Wu, B. F.; Hsu, H. C.; Yeh, J. J.; Yi-Ming Jen | Journal of Marine Science and Technology-Taiwan | | |
2020 | Insight on creep behavior for arrayed interphase nano-precipitation in Ti-Microalloyed HSLA steel | Yang, Y. L.; Lin, Q. X.; Chen, C. Y.; Shing-Hoa Wang ; Chen, H. R.; Tsai, B. S.; Liu, H. C.; Yi-Ming Jen | Materials Chemistry and Physics | | |
2007 | Interfacial parameter analyses for sleeve-pin-shaft connections under axial and torsional cyclic loading using the finite element method | Yi-Ming Jen ; Wei, C. L. | Journal of Strain Analysis for Engineering Design | | |
1997 | Mean strain effect on crack initiation lives for notched specimens under biaxial nonproportional loading paths | Yip, M. C.; Yi-Ming Jen | Journal of Engineering Materials and Technology-Transactions of the Asme | | |