公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 |
---|---|---|---|---|---|
2019 | Residual Stress Image Inspections Based on Bending Testing for Flexible Transparent Conducting Substrates by Single-Direction Common-Path Image Interferometry | Bor-Jiunn Wen ; Huang, S. A. | Ieee Sensors Journal | 3 | |
2017 | Surface Properties of Nano-Film Type Patterning Electrode on Flexible Substrate for Bending Test | Bor-Jiunn Wen ; Lee, C. C.; Chang, M. W.; Lin, H. K.; Liou, Y. Y.; Cheng, S. W. | Science of Advanced Materials | 2 | |
2022 | Thermomechanical Property Measurement of Flexible Transparent Conductive-Film Substrates Based on Whole Folding Test by Reflective- Type Common-Path Liquid-Crystal Modulating Interferometry | Wen, Bor-Jiunn ; Hsu, Jui-Jen | IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 0 |