公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 |
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2018 | Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers | Lau, J. H.; Li, M.; Yang, L.; Xu, I.; Chen, T.; Chen, S.; Yong, Q. X.; Madhukumar, J. P.; Wu Kai ; Fan, N.; Kuah, E.; Li, Z.; Tan, K. H.; Bao, W.; Lim, S. P.; Beica, R.; Ko, C. T.; Xi, C. | Ieee Transactions on Components Packaging and Manufacturing Technology |