| 公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
|---|---|---|---|---|---|---|
| 2006 | Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages | Yi-Ming Jen ; Fang, C. K.; Yeh, Y. H. | Ieee Transactions on Components and Packaging Technologies | |||
| 2006 | Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages | Yi-Ming Jen ; Wu, Y. L.; Fang, C. K. | Microelectronics Reliability |
