| 公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
|---|---|---|---|---|---|---|
| 2018 | Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration | Ko, C. T.; Yang, H.; Lau, J. H.; Li, M.; Lin, C.; Lin, J. W.; Chen, T.; Xu, I.; Chang, C. L.; Pan, J. Y.; Wu, H. H.; Yong, Q. X.; Fan, N.; Kuah, E.; Li, Z.; Tan, K. H.; Cheung, Y. M.; Ng, E.; Wu Kai ; Hao, J.; Beica, R.; Lin, M.; Chen, Y. H.; Cheng, Z.; Wee, K. S.; Ran, J.; Xi, C.; Lim, S. P.; Lee, N. C.; Tao, M.; Lo, J.; Lee, R. S. W. | Ieee Transactions on Components Packaging and Manufacturing Technology | |||
| 1995 | Effect of various degree of deacetylation and molecular weight on polyelectrolyte and rheological properties of chitosan | Min-Lang Tsai ; Chen, R. H.; Lin, J. W. | ||||
| 2009 | An efficient phosphorylation-free and ligase-free PCR-based method for multiple site-directed mutagenesis of up to six distal-sites simultaneously | Fang, T. Y. ; Lin, J. W.; Hung, X. G. | ||||
| 1995 | Relationship between degrees of deacetylation and chain stiffness of chitosan molecule in solution | Chen, R. H.; Lin, J. W.; Min-Lang Tsai |
