| 公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
|---|---|---|---|---|---|---|
| 2020 | The use of surfactants and supercritical CO2 assisted processes in the electroless nickel plating of printed circuit board with blind via | Hung-Bin Lee ; Chen, K. L.; Su, J. W.; Lee, C. Y. | Materials Chemistry and Physics | 8 |
