| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2021 | Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer | Wang, Xiaoli; Chou, Chau-Chang ; Wu, Liberty Tse-Shu; Wu, Rudder; Lee, Jyh-Wei; Chang, Horng-Yi | MATERIALS | 3 |
