| 公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
|---|---|---|---|---|---|---|
| 2026/2/15 | Advanced Sensor Signal Processing for Resolving Overlapping Temperature Events in Industrial Applications | Dejband, Erfan; Tan, Tan-Hsu; Chanie Manie, Yibeltal; Yao, Cheng-Kai; Lin, Tzu-Chiao; Chen, Hung-Ming; Hsu, Wen-Yang ; Peng, Chun-Hsiang; Huang, Po-Young; Peng, Peng-Chun | IEEE SENSORS JOURNAL | |||
| 2022 | Thermomechanical Property Measurement of Flexible Transparent Conductive-Film Substrates Based on Whole Folding Test by Reflective- Type Common-Path Liquid-Crystal Modulating Interferometry | Wen, Bor-Jiunn ; Hsu, Jui-Jen | IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 0 |
