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National Taiwan Ocean University Research Hub
Research Outputs
Browsing by Subject
thermal resistance
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Showing results 1 to 11 of 11
Issue Date
Title
Author(s)
Source
scopus
WOS
Fulltext/Archive link
2012
3-D numerical and experimental models for flat and embedded heat pipes applied in high-end VGA card cooling system
Jung-Chang Wang
International Communications in Heat and Mass Transfer
10
2012
Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system
Rong-Tsu Wang; Jung-Chang Wang
International Communications in Heat and Mass Transfer
8
2010
Development of vapour chamber-based VGA thermal module
Jung-Chang Wang
International Journal of Numerical Methods for Heat & Fluid Flow
18
2008
Heat pipe for cooling of electronic equipment
Yu-Wei Chang
; Chiao-Hung Cheng; Jung-Chang Wang
; Sih-Li Chen
Energy Conversion and Management
82
2014
L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas
Jung-Chang Wang
Heat and Mass Transfer
6
2011
L-type heat pipes application in electronic cooling system
Jung-Chang Wang
International Journal of Thermal Sciences
26
2008
Novel Thermal Resistance Network Analysis of Heat Sink with Embedded Heat Pipes
Jung-Chang Wang
Jordan Journal of Mechanical and Industrial Engineering
2014
Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection
Rong-Tsu Wang; Ya-Wei Lee; Sih-Li Chen; Jung-Chang Wang
International Communications in Heat and Mass Transfer
6
2010
Program for Rapid Computation of the Thermal Performance of a Heat Sink with Embedded Heat Pipes
Jung-Chang Wang
; Rong-Tsu Wang; Chih-Chung Chang; Chun-Ling Huang
Journal of the Chinese Society of Mechanical Engineers
2009
Superposition method to investigate the thermal performance of heat sink with embedded heat pipes
Jung-Chang Wang
International Communications in Heat and Mass Transfer
27
2014
U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
Jung-Chang Wang
Microelectronics Reliability
23
