瀏覽的方式：關鍵字 thermal resistance

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公開日期	標題	作者	來源出版物	scopus	WOS	全文
2012	3-D numerical and experimental models for flat and embedded heat pipes applied in high-end VGA card cooling system	Jung-Chang Wang	International Communications in Heat and Mass Transfer		10
2012	Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system	Rong-Tsu Wang; Jung-Chang Wang	International Communications in Heat and Mass Transfer		8
2010	Development of vapour chamber-based VGA thermal module	Jung-Chang Wang	International Journal of Numerical Methods for Heat & Fluid Flow		18
2008	Heat pipe for cooling of electronic equipment	Yu-Wei Chang ; Chiao-Hung Cheng; Jung-Chang Wang ; Sih-Li Chen	Energy Conversion and Management		82
2014	L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas	Jung-Chang Wang	Heat and Mass Transfer		6
2011	L-type heat pipes application in electronic cooling system	Jung-Chang Wang	International Journal of Thermal Sciences		26
2008	Novel Thermal Resistance Network Analysis of Heat Sink with Embedded Heat Pipes	Jung-Chang Wang	Jordan Journal of Mechanical and Industrial Engineering
2014	Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection	Rong-Tsu Wang; Ya-Wei Lee; Sih-Li Chen; Jung-Chang Wang	International Communications in Heat and Mass Transfer		6
2010	Program for Rapid Computation of the Thermal Performance of a Heat Sink with Embedded Heat Pipes	Jung-Chang Wang ; Rong-Tsu Wang; Chih-Chung Chang; Chun-Ling Huang	Journal of the Chinese Society of Mechanical Engineers
2009	Superposition method to investigate the thermal performance of heat sink with embedded heat pipes	Jung-Chang Wang	International Communications in Heat and Mass Transfer		27
2014	U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method	Jung-Chang Wang	Microelectronics Reliability		23

顯示 1 到 11 筆資料，總共 11 筆