Analysis for the Thermal Performance of Vapor Chamber Thermal Module with Window Software Development

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Project title

Code/計畫編號

NSC97-2218-E019-003

Translated Name/計畫中文名

微均溫板散熱模組熱性能之分析暨視窗軟體開發

Project Coordinator/計畫主持人

Jung-Chang Wang

Funding Organization/主管機關

National Science and Technology Council

Department/Unit

Department of Marine Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=1721218

Year

2008

Start date/計畫起

01-10-2008

Expected Completion/計畫迄

31-07-2009

Bugetid/研究經費

640千元

ResearchField/研究領域

機械工程
資訊科學--軟體

最近幾年電子元件已經更輕薄短小，市面上CPU 的TDP（Thermal Design Power）值已達95W，預計2008 年年底以後，TDP 值將超過130W。節能光電照明LED（Light Emitting Diode）的熱通量更高達50W/cm2 以上，在發熱源處產生了極大的熱點（Hot Spot）問題。為了要解決這樣高熱通量的電子元件產品，半導體製造業的兩大龍頭INTEL 及AMD 與LED 光電產業廠商皆積極找尋下一世代的新冷卻技術。而在這些所有具有可能解決超過TDP 值130W 及熱點問題的新冷卻技術中，微均溫板（Vapor Chamber）散熱模組具有下列四項優點：微均溫板是平板型式，與發熱源直接平面對平面的接觸，大幅降低接觸介面熱阻及擴散熱阻，因此熱性能佳，此為其優點之一。利用工作流體液/氣兩相變化高熱容量的特性，使散熱模組可在很小的溫度梯度下散逸大量的熱，平板上溫差小、均溫性好，此為其優點之二。在工作流體的熱傳遞路徑上，分別利用浮力及毛細壓力來當作氣體與液體的驅動力，不需流體機械幫浦，所以散熱模組具高可靠度，此為其優點之三。微均溫板與鰭片是兩個元件，可直接以低溫錫焊接合或藉由熱管（Heat Pipe）連接，安裝變化性大，可以利用既有的系統風扇散逸熱量，此為其優點之四。因為微均溫板熱模組具有上述眾多優點，所以最有潛力成為下一世代的散熱模組。並可應用來加以改善目前產業中之急需要高速散熱的系統部分，諸如個人電腦的散熱系統、筆記型電腦散熱、伺服器散熱系統、高功率LED 照明等等。本計畫主要研究目的之一為利用熱阻性能實驗開發熱性能高、均溫性佳的微均溫板，預期總熱阻值可突破現有技術達到0.1 ℃/W 以下，並建立實驗控制參數分析結果資料庫。本計畫主要研究目的之二為應用因次分析配合實驗數據資料庫推導微均溫板等效熱傳導係數的經驗公式，並輔以數值分析方法的驗證，期能迅速精確定義微均溫板的熱性能。本計畫主要研究目的之三為使用Visual Basic 程式撰寫一套視窗軟體，期能在數秒之內精確計算微均溫板散熱模組的熱性能。因此，本計劃在學術方面上及工程實際應用上，皆具有相當的研究價值。Recently, the electronic device is more light and small. The TDP (Thermal Design Power) of CPU in the market has achieved 95W and is expected to 130W after the end of 2008. And the heat flux of high power light emitting diode（LED） in the saving energy optical industry is over 50W/cm2. There are very important hot spot problems at the heat source. Nowadays, the two leading manufacturers in the semi-conductor industry and saving energy optical industry, those are INTEL and AMD, are keen to look for new solutions for next generation electronic components. Heat transfer by boiling and condensation is the most potential method to solve these thermal problems of high power and hot spot among the new developing electronic cooling techniques. Upon the idea we design a vapor chamber thermal module and investigate its performance and characteristics. The four advantages of this system are concluded below: 1.The perfect contact area between vapor chamber and heat source is flat because of flat plate vapor chamber, so it can reduce the contact and spreading thermal resistance. And the thermal performance is good. 2. The module can transfer a lot of heat capacity with very small temperature gradient by latent heat between liquid-gas phases. The vapor chamber has small temperature difference. 3. The flow in the system is driven by buoyancy and capillary force. These two driving forces are self-induced, so flow-driven pump component is not necessary in this system. Its reliability is high. 4. The two main components which are vapor chamber and fins are separated and can be directly connected by low temperature stannum soldering or combined with heat pipes. Therefore the arrangement of each component is much flexible. Therefore, with the above pros, the vapor chamber thermal module is the most potential system to overcome the heat dissipation of the next generation electronic equipment and high power LED lighting. The first main purpose of the present research is to develop a high thermal performance and low temperature difference vapor chamber thermal module. By analyzing the thermal resistance experimental, the total thermal resistance will be under the value 0.1 oC/W. The second main purpose of the present research is to utilize dimensional analysis with experimental to derive the correlation of effective thermal conductivity of vapor chamber through the proof of numerical method. The third main purpose of the present research is to build window software by visual basic program. It can calculate quickly and accurately the thermal performance of vapor chamber thermal module in several seconds. Therefore, the present research is essentially valuable in science and engineering applications

Keyword(s)

微均溫板
熱通量
熱點
LED
因次分析
視窗軟體
Vapor Chamber
Heat Flux
Hot Spot
Light Emitting Diode
Dimensional Analysis
Window Software

DSpace CRIS

Analysis for the Thermal Performance of Vapor Chamber Thermal Module with Window Software Development

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