Analysis for the Micro-Scale Condensing and Boiling Pressure Difference Phenomenon with Window Software Development

View Statistics Email Alert RSS Feed

Information

Details

Project title

Code/計畫編號

NSC99-2221-E019-018

Translated Name/計畫中文名

微尺度冷凝沸騰壓差現象之探討暨視窗軟體開發

Project Coordinator/計畫主持人

Jung-Chang Wang

Funding Organization/主管機關

National Science and Technology Council

Department/Unit

Department of Marine Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=2107149

Year

2010

Start date/計畫起

01-08-2010

Expected Completion/計畫迄

31-07-2011

Bugetid/研究經費

667千元

ResearchField/研究領域

機械工程
資訊科學--軟體

隨者明年高熱通量電子元件產品的上市，散熱模組廠商正積極的運用新的技術解決，而台灣的散熱模組產業一直是世界最重要的設計製造基地，如果要持續保持這樣的優勢，比其他國家更領先進一步的開發新的散熱模組技術是非常重要的。兩相流變化傳熱元件是這些新的散熱模組中的重點技術，了解其內部的原理並建立理論模式也是學術界幫助散熱模組業界的責任。其中兩相封閉迴路式熱虹吸管散熱模組具有下列五項優點：利用工作流體液/氣兩相變化高熱容量的特性，使散熱模組可在很小的溫度梯度下散逸大量的熱，所表現的熱性能佳，此為其優點之一。在工作流體的熱傳遞路徑上，分別利用浮力及重力來當作氣體與液體的驅動力，不需流體機械幫浦，所以散熱模組具高可靠度，此為其優點之二。蒸發腔體與冷凝器是分開的，由聯結管路連接，管路具可撓性，安裝變化性大，冷凝器可以利用既有的系統風扇，此為其優點之三。散熱模組中的蒸發腔體與冷凝器可以是多個串/並聯的，所以具有高擴展性，此為其優點之四。散熱模組由蒸發腔體、可撓性聯結管路、冷凝器三個部分組成，所以可以模組化製造安裝，成本低廉，此為其優點之五。因為，兩相封閉迴路式熱虹吸管散熱模組具有上述眾多優點，是最有潛力成為下一世代的散熱模組。可加以應用改善目前產業中之急需要高速散熱的系統部分，諸如個人電腦的散熱系統、筆記型電腦散熱、伺服器散熱系統、高功率LED 照明等等。為了能夠完整充分探討最有潛力成為下一世代的散熱模組－兩相封閉迴路式熱虹吸管散熱模組的特性，以解決超過TDP 值130W 的CPU，以期使總熱阻降低至0.3°C/W 以下，所以本計畫研究目的為建立冷凝沸騰液汽兩相流動壓差之理論模式及數值模擬分析方法，以作為發展的理論基礎。研究目的之二，為建立可視化的兩相封閉迴路是熱虹吸管散熱模組，以其與理論結果作比較，並可做為修正理論模式的基礎。研究目的之三為發展兩相封閉迴路式熱虹吸管最佳化的散熱模組，以期使總熱阻降低至0.3°C/W 以下。本計劃在學術方面上及工程實際應用上，皆具有相當的研究價值。The thermal module companies are looking for new cooling technologies for solving thermal problem as announcement of high heat flux device next year. Taiwan is the most important design and manufacture base for the thermal module industry in the world. It must be understand the two-phase flow device solving high heat flux heat source in order to maintain the superiority than other countries. Heat transfer by boiling and condensation is the most potential method among the new developing electronic cooling techniques. Upon the idea we design a Two-Phase Closed Loop Thermosyphon Cooling System and investigate its performance and characteristics. The 5 advantages of this system are concluded below: 1.The module can transfer a lot of heat with very small temperature gradient by latent heat between liquid-gas phases. 2. The flow in the system is driven by buoyancy and gravity force. These two driving forces are self-induced, so flow-driven pump component is not necessary in this system. 3. The two main components which are evaporator and condenser are separated and connected with pipes. Therefore the arrangement of each component is much flexible. 4. Besides, each of the three sections can be individually manufactured, which provides cost-efficiency. 5. It is highly available to combine more evaporators and condensers in series connection or parallel connection in the cooling system if extension is wanted. Therefore, with the above pros, the Two-Phase Closed Loop Thermosyphon Cooling Module is the most potential system to overcome the heat dissipation of the next generation electronic equipment, i.e. P.C., notebook, server, LED lighting. This project is to solve the commercialized for CPU with 130W TDP. The first main goal of the project is to derive the fundamental theories of the pressure difference theory model of the two-phase flow and the method of simulation analysis. Base on the results, the second main purpose of the project is to set up and utilize the thermal performance experiment to analyze the thermal performance of the visual experiment of the two-phase flow closed thermosyphon thermal module and advise the theory model of this project comparing these results. The third main purpose of the project is to develop optimum parameters with which the Two -Phase Closed Loop Cooling Systems could achieve best performances. And they can obtain total thermal resistance under 0.3°C/W. Generally, the project is worthy both in theoretic research and engineering application.

Keyword(s)

熱虹吸管
壓差
熱阻
熱性能
Thermosyphon
Pressure Difference
Thermal resistance
Thermal performance.

DSpace CRIS

Analysis for the Micro-Scale Condensing and Boiling Pressure Difference Phenomenon with Window Software Development

Details

Description