The Innovative Recombining Technique for a Large-Area Metal Molding with Nano/Micro-Scale Features

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Project title

Code/計畫編號

NSC93-2622-E019-005-CC3

Translated Name/計畫中文名

具奈微米級元件之超晶圓尺寸金屬模具製作

Project Coordinator/計畫主持人

Chih-Wei Wu

Funding Organization/主管機關

National Science and Technology Council

Department/Unit

Department of Mechanical and Mechatronic Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=1059085

Year

2004

Start date/計畫起

01-11-2004

Expected Completion/計畫迄

01-10-2005

Bugetid/研究經費

483千元

ResearchField/研究領域

自動化工程(工)
機械工程

傳統精密模具製作成大面積且具有微結構之技術相當困難；反觀以微機電製程技術可輕易製作微結構但卻受限於晶圓尺寸而無法製作大面積。因此，本研究除成功地驗證矽晶圓側向接合技術之可行性外，另利用被動式對準機制，用以改善矽晶圓於側向接合所發生之高低差、間隙、翹曲等問題(圖 1)，並達成奈微米級結構精密定位之目標。依照上述之技術可得到間隙為39μm、高低差 1.4μm、翹曲角度為 2.3°的矽晶圓接板。本研究更進一步採用電鍍法將矽晶圓模具轉換成具對準功能之奈微米元件鎳模具，並達到金屬接板間隙 42.2μm，高低差為 3.6μm 之成果。此外，更進一步以上述鎳模具進行 PDMS 複製，而 PDMS 之複製結果亦將接合表面高差與間隙分別控制於微米的程度。相信此概念與成果可同時解決精密模具面積不足與矽晶圓模具易碎之困擾，並提供降低模具成本的方法，更能提高精密模具製作技術。The conventional techniques capable of manufacturing large-size structures in a very large plate pose severe challenges in making microstructures. In contrast, current microfabrication that employs lithographic processes to form micro scale features is limited in its wafer scale. This paper offer an innovative micro-scale passive-alignment recombining technique using lateral joining for a large-area molding with small features is to be design and fabrication by using MEMS technologies. With passive-alignment technique, we can solve the height difference、gap、tilting problems between two joining wafers, and make sure that the microstructures on specific wafers will be aligned precisely. Because the mounting force of the fiber, it is proved that control the height difference within 1.4µm, the gap within 39µm, the tilting within 2.3 ∘ . We employ the micro-electroplating technique further to replicate the joined silicon plate to nickel metal mold in order to solve the brittle drawback of Si. The gap and height difference at joined interface of metal mold are 42.2μm and 3.6μm respectively. Besides, The replication of the metal mold using PDMS is also controlled within micrometer level. In summary, the potential of this technique would be significant for a very large plate beyond a wafer size with microstructures and overcome the brittle problem of silicon mold, and provides a new approach with a high replication and potentially low cost.

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The Innovative Recombining Technique for a Large-Area Metal Molding with Nano/Micro-Scale Features

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