An Investigation on the Film Forming Mechanisms and Mechanical Properties of Cu/Ni-Microdiamond Multilayers on Copper Alloy Substrates by Composite Electrodeposition Technology

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Project title

Code/計畫編號

MOST108-2221-E019-050

Translated Name/計畫中文名

複合電沉積技術被覆銅/鎳-微米鑽石多層膜於銅合金基材的成膜機理及機械性質研究

Project Coordinator/計畫主持人

Chau-Chang Chou

Funding Organization/主管機關

National Science and Technology Council

Department/Unit

Department of Mechanical and Mechatronic Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=13120287

Year

2019

Start date/計畫起

01-08-2019

Expected Completion/計畫迄

01-07-2020

Bugetid/研究經費

960千元

ResearchField/研究領域

機械工程

本研究利用複合電沉積技術，製備2-4微米鑽石金屬基複合膜於黃銅金屬底材上，利用電子顯微鏡、光學顯微鏡、能譜分析儀觀察了鍍層的表面形貌特徵，對比分析了不同製程參數對鍍層鑽石含量及分佈均勻性的影響。利用X-射線繞射分析測定了鍍層元素的組成和結晶方向；利用聚焦離子束和穿透式電子顯微鏡分析了膜層間及鑽石顆粒與周圍金屬底材的結合情況；利用電化學工作站分析了鍍層阻抗和耐蝕性。通過壓痕、刮痕和磨耗實驗，測試複合鍍層的機械性能，發現存在兩種磨耗機制，一是在壓頭施加負載後鍍層能夠部分反彈，鍍層的反彈機制具有吸收加工過程中的變形和振動的潛在優勢；二是壓入機制能夠有效防止鑽石顆粒的脫落，提高複合鍍層的耐久性。在韌性較好的黃銅底材上電沉積複合鑽石鍍層有望成為加工脆性材料的良好刀具選擇。 Bilayers on brass substrates by a composite electrodeposition technique was prepared by using diamonds with a diameter of 2-4 μm. In order to improve the adhesion between the coating and the substrate, the electroplated pure copper was coated as the bottom layer, then the nickel and the diamond were compositely electrodeposited. The effects of current density, stirring speed, and diamond concentration in the electrolyte on the mechanical properties of the coating were investigated. The content and distribution of the incorporated diamond were analyzed by electron microscopy. The result of the wear test indicated that no coating composition was transferred to the glass ball, which meant the coating did not contaminate the glass material. The unique press-in mechanism protected the pull-off of the diamond and prolonged the tool’s service life. The rebounding mechanism of the coating was also feasible to the machining process of the glass, which could avoid the fragment of the thin glass. The use of the composite electrodeposition technique can remarkly reduce the manufacture cost of the micro-milling tool and, in the mean time, improve the machininng efficency and quality of hard and fragile materials.

Keyword(s)

電化學沉積
複合層
鑽石
耐磨性
結合力
多物理耦合模擬
electrodeposition
composite layer
diamond
wear resistance
adhesion
multiphysical simulation

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An Investigation on the Film Forming Mechanisms and Mechanical Properties of Cu/Ni-Microdiamond Multilayers on Copper Alloy Substrates by Composite Electrodeposition Technology

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