The Study of Integrated Polishing System for Wafer Workpieces

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Project title

Code/計畫編號

NSC89-2212-E019-004

Translated Name/計畫中文名

薄板工件之整合精密拋光系統研究---總計畫

Funding Organization/主管機關

National Science and Technology Council

Co-Investigator(s)/共同執行人

林正平
蘇耀藤

Department/Unit

Department of Mechanical and Mechatronic Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=526614

Year

2000

Start date/計畫起

01-08-1999

Expected Completion/計畫迄

01-07-2000

Co-Investigator(s)

Chang-Pin Lin

Bugetid/研究經費

1497千元

ResearchField/研究領域

機械工程

Keyword(s)

精密拋光
整合拋光系統
研磨
薄板工件
Precision polishing
Integrated polishing system
Lapping
Thin plate workpiece