Investigation of automatic image-type residual folding, thermal stresses, and electrical-property measurement and analysis of flexible transparent conducting substrates for whole folding test

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基本資料

Project title

Code/計畫編號

MOST105-2221-E019-029

Translated Name/計畫中文名

軟性透明導電基板全面性摺疊測試之自動化影像式殘留摺疊、熱應力和電性特性量測與分析研究

Project Coordinator/計畫主持人

Bor-Jiunn Wen

Funding Organization/主管機關

National Science and Technology Council

Department/Unit

Department of Mechanical and Mechatronic Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=12451778

Year

2016

Start date/計畫起

01-08-2016

Expected Completion/計畫迄

01-07-2017

Bugetid/研究經費

748千元

ResearchField/研究領域

機械工程

軟性電子與薄膜元件為現代科技的發展重心之一，其中最廣泛的應用為下一世代顯示器發展的主力「軟性顯示器」。軟性顯示器是具有輕、薄、可撓與耐衝擊的顯示器，它在未來將成為一種熱門的電子產品。例如，軟性顯示器是具有和紙張一樣的撓曲與摺疊能力，並且可以達到將大尺寸顯示器摺疊成小尺寸的行動通訊產品。因此，軟性顯示器的撓曲與摺疊特性測試將會扮演相當重要的角色，尤其在目前的研究和生產階段。為了提供在不同摺疊或製程階段中之一個快速與大面積之應力集中檢測，本研究提案創造開發一個影像式相位延遲量測技術。有鑑於撓曲或摺疊測試為一局部性測試機制，針對軟性電子的整體撓曲或摺疊特性需求，本研究利用一已完成開發之自動化滑動全面性摺疊控制測試平台，以滿足針對軟性電子的整體撓曲或摺疊特性檢測之需求。根據材料力學，殘留應力包含機械與熱的結構性破壞。在本研究中，一個透過全面撓曲或摺疊測試下，完成設計與建立利用相位延遲特性與光電特性理論關係開發創造一自動化之摺疊破壞殘留應力量測與分析。另外，由於軟性透明導電基板的缺陷或殘留應力會改變導電薄膜厚度與造成薄膜的裂痕，這效應會增加軟性透明導電基板的電阻。因此，本研究完成整合四點探針阻值量測技術於自動化滑動全面性摺疊控制測試平台，來提供摺疊測試過程中之電性特性即時檢測需求。最終，本研究完成鍍膜不同Indium tin oxide厚度(80 nm、160 nm與230 nm)於Polyethylene terephthalate(厚度為125 μm)的軟性透明導電基板全面性摺疊測試(摺疊半徑最小至5 mm)之自動化影像式殘留摺疊應力和電性特性量測與分析研究。由研究結果中可知摺疊破壞殘留應力與電性有著正相關結論，並由影像式殘留應力量測結果可得到製程過程中的缺失，來達到製程參數微調回饋貢獻，以致可以提供軟性電子設計者與製造者開發，來設計出實用與便利的可撓電子產品。 To provide a high-speed and big-size measurement of stress-concentration distribution of flexible transparent conducting substrates for different processes of folding tests or manufactures, this study creates an image-type phase-retardation measurement technology. According to mechanics of materials, residual stresses include mechanical and thermal structure deformations. In this study, automatic folding-deformation image-type residual-stress measurement and analysis of flexible transparent conducting substrates for the whole-area bending or folding test are designed and set up by using the relationship theory between phase-retardation characteristics and optoelectronics. In addition, defects or residual stresses on the flexible transparent conducting substrates change thicknesses of transparent conducting films and make cracks on the films. The effect increases electrical resistances of the flexible transparent conducting substrates. Therefore, this study creates a four-point-probe resistance measurement technology to integrate into automatic sliding-folding control test platform for electrical-characteristics-measurement requirements of real-time folding test. Eventually, this study measures and analyzes image-type residual-stress and electrical characteristics of the different indium tin oxide films, based on the thicknesses of 80 nm, 160 nm, and 230 nm, deposited on polyethylene terephthalate substrates based on a thickness of 125 μm for whole-folding test up to 5 mm folding radius. According to the results, there is a positive-correlation-conclusion relationship between folding-deformation residual-stress and electrical characteristics. Moreover, manufacturing defects are obtained for feedback contribution of modifying manufacturing parameters by using image-type residual-stress measurement results. Hence, research results of this study depicted on flexible electronics help a designer or maker design useful and comfortable flexible-electronics products.

Keyword(s)

軟性電子
自動化滑動全面性摺疊控制測試平台
影像式相位延遲量測技術
自動化之摺疊破壞殘留應力量測與分析
四點探針阻值量測技術
flexible electronic device
automatic sliding-whole-folding control test platform
image-type phase-retardation measurement technology
automatic folding-deformation image-type residual-stress measurement and analysis
four-point-probe resistance measurement technology

DSpace CRIS

Investigation of automatic image-type residual folding, thermal stresses, and electrical-property measurement and analysis of flexible transparent conducting substrates for whole folding test

基本資料

Description