Interfacial-Stress Investigation of Flexible Transparent Multilayer Thin-Film Substrates by an Automatic Image-Type Single-Direction Common-Path Interferometry

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簡歷

基本資料

Project title

Code/計畫編號

MOST107-2221-E019-053

Translated Name/計畫中文名

自動化影像式單方向共光程干涉術於軟性透明多層薄膜基板之介面應力研究

Project Coordinator/計畫主持人

Bor-Jiunn Wen

Funding Organization/主管機關

National Science and Technology Council

Department/Unit

Department of Mechanical and Mechatronic Engineering

Website

https://www.grb.gov.tw/search/planDetail?id=12675621

Year

2018

Start date/計畫起

01-08-2018

Expected Completion/計畫迄

01-07-2019

Bugetid/研究經費

688千元

ResearchField/研究領域

機械工程

消耗性產品包含手機、筆記型電腦、桌上監視器與其他數位家用家電近年來變得越來越多樣化，其中最廣泛的應用為下一世代顯示器發展的主力「軟性顯示器」。軟性顯示器是具有輕、薄、可撓與耐衝擊的顯示器，它在未來將成為一種熱門的電子產品。例如，軟性顯示器是具有和紙張一樣的撓曲與摺疊能力，並且可以達到將大尺寸顯示器摺疊成小尺寸的行動通訊產品。有鑒於軟性電子的薄膜介面黏著力不足或殘留應力問題導致光學薄膜特性、水氧穿透率與機械保護膜層製程參數和產品壽命都還未達到可真正商品化的條件。本研究提案創造開發反射式自動化影像式單方向共光程干涉術於軟性透明多層薄膜基板之介面應力量測研究。除此之外，本研究將透過在基板與薄膜中間外加一層附著材料層，以提供更好的介面黏著力與降低殘留應力。接著將這拉伸力與溫度加熱之反射式自動化影像式單方向共光程干涉技術整合於自動化滑動摺疊控制測試系統，以針對多次全面摺疊測試前與後之各膜層的介面殘留黏著力與應力來作量測與分析，完成驗證利用外加附著材料層技術來改善之其電性與應力特性。最終，根據本研究提案的研發成果將可以提供軟性電子設計者與製造者開發設計出實用與便利的可撓電子產品。 Consumer product designs, including cellular phones, notebook computers, monitor displays, and other digital household appliances are becoming more and more diversified recently. One of the most widespread applications is “flexible display”, which is mainly developed for the next generation monitor. Flexible display is light, thin, flexible, and shock-resistant. It will become a promising product in the days to come. For example, flexible displays allow for bendable and foldable styles that resemble those used in paper documents; moreover, big-size one can be folded to become a small-size mobile product. In view of the inadequate adhesive force of the thin film interface of the flexible electronics or the residual stress problems that cause the optical film characteristics, the process parameters of the water vapor, oxygen transmission rates, and the mechanical protective film layer, and the product lifetimes have not yet reached the conditions that can be truly commercialized. This proposal project creates an interfacial-stress investigation of flexible transparent multilayer thin-film substrates by a reflective automatic image-type single-direction common-path interferometry. Additionally, an adhesive material layer is applied between the substrate and the film to provide better interfacial adhesion and reduce residual stress in this study. To complete the verification using the additional layer of material technology to improve electrical and stress characteristics of multilayer thin-film substrates, this tensile force and temperature heating of the reflective automatic image-type single-direction common-path interferometry are integrated into the automatic sliding-folding control test system for measurement and analysis of each layer of the interface residual adhesion and stress before and after multiple whole-area folding test. Eventually, research results of this proposal project depicted on flexible electronics help a designer or maker design useful and comfortable flexible-electronics products.

Keyword(s)

軟性電子
反射式自動化影像式單方向共光程干涉術
附著材料層
自動化滑動摺疊控制測試系統
介面殘留黏著力與應力量測與分析
flexible electronics
reflective automatic image-type single-direction common-path interferometry
adhesive material layer
automatic sliding-folding control test system
measurement and analysis of each layer of the interface residual adhesion and stress

DSpace CRIS

Interfacial-Stress Investigation of Flexible Transparent Multilayer Thin-Film Substrates by an Automatic Image-Type Single-Direction Common-Path Interferometry

基本資料

Description