第 1 到 2 筆結果,共 2 筆。
公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 | |
---|---|---|---|---|---|---|
1 | 2020 | A meshless collocation scheme for inverse heat conduction problem in three-dimensional functionally graded materials | Wen Hu; Yan Gu; Chia-Ming Fan | Engineering Analysis with Boundary Elements | 11 | |
2 | 2019 | Analysis of three-dimensional heat conduction in functionally graded materials by using a hybrid numerical method | Wenzhen Qu; Chia-Ming Fan ; Yaoming Zhang | International Journal of Heat and Mass Transfer | 22 |