Results 1-2 of 2 (Search time: 0.003 seconds).
Issue Date | Title | Author(s) | Source | WOS | Fulltext/Archive link | |
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1 | 2020 | A meshless collocation scheme for inverse heat conduction problem in three-dimensional functionally graded materials | Wen Hu; Yan Gu; Chia-Ming Fan | Engineering Analysis with Boundary Elements | 11 | |
2 | 2019 | Analysis of three-dimensional heat conduction in functionally graded materials by using a hybrid numerical method | Wenzhen Qu; Chia-Ming Fan ; Yaoming Zhang | International Journal of Heat and Mass Transfer | 22 |