第 1 到 3 筆結果,共 3 筆。
公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 | |
---|---|---|---|---|---|---|
1 | 2006 | Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages | Yi-Ming Jen ; Fang, C. K.; Yeh, Y. H. | Ieee Transactions on Components and Packaging Technologies | ||
2 | 2006 | Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages | Yi-Ming Jen ; Wu, Y. L.; Fang, C. K. | Microelectronics Reliability | ||
3 | 2006 | Effect of lid materials on the solder ball reliability of thermally enhanced flip-chip plastic ball grid array packages | Yi-Ming Jen ; Chien, H. H.; Lin, T. S.; Huang, S. H. | Fracture and Strength of Solids Vi, Pts 1 and 2 |