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Issue Date | Title | Author(s) | Source | WOS | Fulltext/Archive link | |
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1 | 2006 | Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages | Yi-Ming Jen ; Fang, C. K.; Yeh, Y. H. | Ieee Transactions on Components and Packaging Technologies | ||
2 | 2006 | Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages | Yi-Ming Jen ; Wu, Y. L.; Fang, C. K. | Microelectronics Reliability |