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Issue Date | Title | Author(s) | Source | WOS | Fulltext/Archive link | |
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1 | 2011 | Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth | Chiou, Y. C.; Yi-Ming Jen ; Huang, S. H. | Microelectronics Reliability | ||
2 | 2006 | Effect of lid materials on the solder ball reliability of thermally enhanced flip-chip plastic ball grid array packages | Yi-Ming Jen ; Chien, H. H.; Lin, T. S.; Huang, S. H. | Fracture and Strength of Solids Vi, Pts 1 and 2 |