第 1 到 4 筆結果,共 4 筆。
公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 | |
---|---|---|---|---|---|---|
1 | 2011 | Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth | Chiou, Y. C.; Yi-Ming Jen ; Huang, S. H. | Microelectronics Reliability | ||
2 | 2011 | Experimental investigation on the effect of tensile pre-strain on ratcheting behavior of 430 Stainless Steel under fully-reversed loading condition | Chiou, Y. C.; Wen-Kai Weng ; Yi-Ming Jen | Engineering Failure Analysis | ||
3 | 2011 | Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages | Yi-Ming Jen ; Chiou, Y. C.; Yu, C. L. | Engineering Failure Analysis | ||
4 | 2010 | Application of the endochronic theory of plasticity for life prediction with asymmetric axial cyclic straining of AISI 304 stainless steel | Yi-Ming Jen ; Chiou, Y. C. | International Journal of Fatigue |