第 1 到 2 筆結果,共 2 筆。
公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 | |
---|---|---|---|---|---|---|
1 | 2011 | Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth | Chiou, Y. C.; Yi-Ming Jen ; Huang, S. H. | Microelectronics Reliability | ||
2 | 2006 | Effect of lid materials on the solder ball reliability of thermally enhanced flip-chip plastic ball grid array packages | Yi-Ming Jen ; Chien, H. H.; Lin, T. S.; Huang, S. H. | Fracture and Strength of Solids Vi, Pts 1 and 2 |