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Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/1195
Title: A meshless collocation scheme for inverse heat conduction problem in three-dimensional functionally graded materials
Authors: Wen Hu
Yan Gu
Chia-Ming Fan 
Keywords: Meshless method;Generalized finite difference method;Functionally graded materials;Inverse Cauchy problems;Three-dimensional steady-state heat conduction problem
Issue Date: May-2020
Journal Volume: 114
Start page/Pages: 1-7
Source: Engineering Analysis with Boundary Elements
Abstract: 
This short communication documents the first attempt to apply the generalized finite difference method (GFDM) for inverse heat conduction analysis of functionally graded materials (FGMs). The fact that the GFDM is a meshless collocation method makes it particularly attractive in solving problems with complex geometries and high dimensions. By employing the Taylor series expansion and the moving least-squares technique, the method produces sparse and banded matrix which makes it possible to perform large-scale simulations. Three benchmark examples are provided to demonstrate the accuracy and adaptability of the GFDM approach in solving the inverse Cauchy problems. The convergence and stability of the method with respect to the amount of noise added into the input data are analyzed.
URI: http://scholars.ntou.edu.tw/handle/123456789/1195
ISSN: 0955-7997
DOI: 10.1016/j.enganabound.2020.02.001
Appears in Collections:河海工程學系

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