The Comparison of Cracking Susceptibility of IN52M and IN52MSS Overlay Welds

Abstract

Overlay-welding of IN52M and IN52MSS onto CF8A stainless steel (SS) was conducted by a gas tungsten arc welding process in multiple passes. An electron probe micro-analyzer (EPMA) was applied to determine the distributions and chemical compositions of the grain boundary microconstituents, and the structures were identified by electron backscatter diffraction (EBSD). The hot cracking of the overlay welds was related to the microconstituents at the interdendritic boundaries. The formation of γ-intermetallic (Ni3(Nb,Mo)) eutectics was responsible predominantly for the hot cracking of the 52M and 52MSS overlays. The greater Nb and Mo contents in the 52MSS overlay enhanced the formation of coarser microconstituents in greater amounts at the interdendritic boundaries. Thus, the hot cracking sensitivity of the 52MSS overlay was higher than that of the 52M overlay. Moreover, migrated grain boundaries were observed in the 52M and 52MSS overlays but did not induce ductility dip cracking (DDC) in this study.