|Title:||Prediction of Ablated Region of Ultrafast-pulse Laser Processing for Alumina.||Authors:||Ching-Yen Ho
|Keywords:||Ultrafast-pulse laser;Ablated region;Alumina;Processing;Analytical model||Issue Date:||Mar-2015||Journal Volume:||19||Journal Issue:||5||Start page/Pages:||S5-744–S5-747.||Source:||Materials Research Innovations,||Abstract:||
This study proposed an analytical model to calculate the ablated region of ultrafast-pulse laser processing for alumina, which is widely used in electronics and medicine. More extensive applications for alumina ceramics are limited because of their machining difficulty and severe cutting tool wear. The use of ultrafast-pulse laser in the structuring and drilling of ceramics has been actively researched in recent years. By considering the evaporation to be the material removal mechanism, this study utilised a thermal transport equation with the energy balance at the solid–vapour interface to analyse the removal shape of alumina ablated by ultrafast-pulse laser. The ablation rate and opening diameter computed by the model of this work were compared to the applicable measured data. The effects of machining parameters on the removal region of ultrafast-pulse laser processing for alumina were also discussed.
|Appears in Collections:||食品安全與風險管理研究所|
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