|Title:||Diffusion Barrier Characteristics of WSiN Films||Authors:||Chen, Yung-, I
|Keywords:||Cu metallization;Cu3Si;diffusion barrier;WSiN||Issue Date:||1-Jun-2022||Publisher:||MDPI||Journal Volume:||12||Journal Issue:||6||Source:||COATINGS||Abstract:||
WSiN films were produced through hybrid pulse direct current/radio frequency magnetron co-sputtering and evaluated as diffusion barriers for Cu metallization. The Cu/WSiN/Si assemblies were annealed for 1 h in a vacuum at 500-900 degrees C. The structural stability and diffusion barrier performance of the WSiN films were explored through X-ray diffraction, Auger electron spectroscopy, and sheet resistance measurement. The results indicated that the Si content of WSiN films increased from 0 to 9 at.% as the power applied to the Si target was increased from 0 to 150 W. The as-deposited W76N24, W68Si0N32, and W63Si4N33 films formed a face-centered cubic W2N phase, whereas the as-deposited W59Si9N32 film was near-amorphous. The lattice constants of crystalline WSiN films decreased after annealing. The sheet resistance of crystalline WSiN films exhibited a sharp increase as they were annealed at 800 degrees C, accompanied by the formation of a Cu3Si compound. The failure of the near-amorphous W59Si9N32 barrier against Cu diffusion was observed when annealed at 900 degrees C.
|Appears in Collections:||光電與材料科技學系|
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