http://scholars.ntou.edu.tw/handle/123456789/3114| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yi-Ming Jen | en_US |
| dc.contributor.author | Chiou, Y. C. | en_US |
| dc.contributor.author | Yu, C. L. | en_US |
| dc.date.accessioned | 2020-11-18T02:42:56Z | - |
| dc.date.available | 2020-11-18T02:42:56Z | - |
| dc.date.issued | 2011-03 | - |
| dc.identifier.issn | 1350-6307 | - |
| dc.identifier.uri | http://scholars.ntou.edu.tw/handle/123456789/3114 | - |
| dc.relation.ispartof | Engineering Failure Analysis | en_US |
| dc.title | Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages | en_US |
| dc.type | journal article | en_US |
| dc.identifier.doi | 10.1016/j.engfailanal.2010.12.026 | - |
| dc.identifier.doi | <Go to ISI>://WOS:000288881300030 | - |
| dc.identifier.url | <Go to ISI>://WOS:000288881300030 | |
| dc.relation.journalvolume | 18 | en_US |
| dc.relation.journalissue | 2 | en_US |
| item.cerifentitytype | Publications | - |
| item.openairetype | journal article | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
| item.fulltext | no fulltext | - |
| item.grantfulltext | none | - |
| crisitem.author.dept | College of Engineering | - |
| crisitem.author.dept | Department of Mechanical and Mechatronic Engineering | - |
| crisitem.author.dept | National Taiwan Ocean University,NTOU | - |
| crisitem.author.parentorg | National Taiwan Ocean University,NTOU | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 機械與機電工程學系 | |
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