Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/3114

Title:	Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages
Authors:	Yi-Ming Jen Chiou, Y. C. Yu, C. L.
Issue Date:	Mar-2011
Journal Volume:	18
Journal Issue:	2
Source:	Engineering Failure Analysis
URI:	http://scholars.ntou.edu.tw/handle/123456789/3114
ISSN:	1350-6307
DOI:	10.1016/j.engfailanal.2010.12.026 ://WOS:000288881300030
Appears in Collections:	機械與機電工程學系

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