Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages

請用此 Handle URI 來引用此文件： http://scholars.ntou.edu.tw/handle/123456789/3115

標題:	Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages
作者:	Yi-Ming Jen Fang, C. K. Yeh, Y. H.
公開日期:	十二月-2006
卷:	29
期:	4
來源出版物:	Ieee Transactions on Components and Packaging Technologies
URI:	http://scholars.ntou.edu.tw/handle/123456789/3115
ISSN:	1521-3331
DOI:	10.1109/tcapt.2006.885927 ://WOS:000242688900002
顯示於：	機械與機電工程學系

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