Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

請用此 Handle URI 來引用此文件： http://scholars.ntou.edu.tw/handle/123456789/4491

標題:	Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers
作者:	Lau, J. H. Li, M. Yang, L. Xu, I. Chen, T. Chen, S. Yong, Q. X. Madhukumar, J. P. Wu Kai Fan, N. Kuah, E. Li, Z. Tan, K. H. Bao, W. Lim, S. P. Beica, R. Ko, C. T. Xi, C.
公開日期:	十月-2018
卷:	8
期:	10
來源出版物:	Ieee Transactions on Components Packaging and Manufacturing Technology
URI:	http://scholars.ntou.edu.tw/handle/123456789/4491
ISSN:	2156-3950
DOI:	10.1109/tcpmt.2018.2848666 ://WOS:000447078400003 ://WOS:000447078400003
顯示於：	光電與材料科技學系

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