公開日期 | 標題 | 作者 | 來源出版物 | WOS | 全文 |
2019 | Structural characterization and anti-inflammatory activity evaluation of chemical constituents in the extract of Trifolium repens L | Chen, Y. H.; Chen, P. H.; Wane, Y.; Yang, C. H.; Wu, X. N.; Chang-Jer Wu ; Luo, L. Z.; Wang, Q. H.; Niu, C. L.; Yao, E. Y. | Journal of Food Biochemistry | 1 | |
2017 | The Vibrio cholerae var regulon encodes a metallo-beta-lactamase and an antibiotic efflux pump, which are regulated by VarR, a LysRtype transcription factor | Massam-Wu, T.; Lin, C. P.; Wang, Y. J. A.; Shen, Y. C.; Lu, W. J.; Pang-Hung Hsu ; Chen, Y. H.; Borges-Walmsley, M. I.; Walmsley, A. R.; Hong-Ting Lin | Plos One | 18 | |
2013 | Thermal stability of Ir-Re coatings annealed in oxygen-containing atmospheres | Liu, S. C.; Yung-I Chen ; Tsai, H. Y.; Lin, K. C.; Chen, Y. H. | Surface & Coatings Technology | 15 | |
2009 | A thermally cured 9,9-diarylfluorene-based triaryldiamine polymer displaying high hole mobility and remarkable ambient stability | Lin, C. Y.; Lin, Y. C.; Wen-Yi Hung ; Wong, K. T.; Kwong, R. C.; Xia, S. C.; Chen, Y. H.; Wu, C. I. | Journal of Materials Chemistry | 46 | |
2004 | Up-regulation of muscle-specific transcription factors during embryonic somitogenesis of zebrafish (Danio rerio) by knock-down of myostatin-1 | Amali, A. A.; Lin, C. J. F.; Chen, Y. H.; Wang, W. L.; Lee, C. Y.; Ko, Y. L.; Jenn-Kan Lu ; Her, G. M.; Chen, T. T.; Wu, J. L.; Hong-Yi Gong | Developmental Dynamics | | |
2005 | Up-regulation of muscle-specific transcription factors during embryonic somitogenesis of zebrafish (Danio rerio) by knock-down of myostatin-1 (vol 229, pg 847, 2004) | Amali, A. A.; Lin, C. J. F.; Chen, Y. H.; Wang, W. L.; Lee, C. Y.; Ko, Y. L.; Jenn-Kan Lu ; Her, G. M.; Chen, T. T.; Wu, J. L.; Hong-Yi Gong | Developmental Dynamics | | |
2017 | Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging | Lau, J. H.; Li, M.; Tian, D. W.; Fan, N.; Kuah, E.; Wu Kai ; Hao, J.; Cheung, Y. M.; Li, Z.; Tan, K. H.; Beica, R.; Taylor, T.; Ko, C. T.; Yang, H.; Chen, Y. H.; Lim, S. P.; Lee, N. C.; Ran, J.; Xi, C.; Wee, K. S.; Yong, Q. X. | Ieee Transactions on Components Packaging and Manufacturing Technology | | |