Applied Vapor Chambers on Non-Uniform Thermo Physical Conditions

Abstract

A vapor chamber is a two-phase heat transfer components with a function of spreading and transferring uniformly heat capacity so that it is ideal for use in non-uniform heating conditions. This article mainly researches in vapor chamber application on non-uniform heating electronic components, such as CPU, GPU, and LED, with its ability to spread and heat transfer. Firstly, the calculation program developed in this paper named as VCEK_ML V1 and BaseResistance_ML employ to estimating the ability for spreading and transferring heat amount of vapor chamber. Then the Windows software VCTM V1.0 with the thermal-performance experiment analyzes the thermal phenomena of the Vapor Chamber module in the thermo physical conditions of non-uniform heat source, and finally, a thermal imager can be employed and proved the heat spreading capability of vapor chamber through the temperature distributions. The results showed that, a vapor chamber module can effectively improve the thermo physical conditions of non-uniform heat distribution phenomenon, which is better than pure copper and pure aluminum plates. 均温板(Vapor Chamber)为一两相流热传组件，具有将热量均匀扩散传递的功能，非常适合应 用在不均匀发热的热源条件上。本文主要即是探讨均温板应用于非均匀发热的电子组件，如 CPU、GPU 及 LED 等，其扩散传递热量的能力。首先利用本文所开发的计算程序 VCEK_ML V1 及 BaseResistance_ML，先行估算均温板的扩散传递热量的能力，再使用窗口软件 VCTM V1.0 配合热性 能实验，分析整个均温板模块在非均匀热源物理条件的热流现象，最后可藉由热显像仪的温度分布结 果验证均温板扩散热量的传递能力。结果显示，均温板模块可有效改善非均匀热物理条件的热分布现 象，比纯铜及纯铝板佳。