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請用此 Handle URI 來引用此文件: http://scholars.ntou.edu.tw/handle/123456789/17102
標題: HEAT TRANSFER ANALYSIS OF HEAT SINK MODULES FOR HIGH-POWER LED EQUIPMENT
作者: Hu, Hai-Ping 
Yeh, Rong-Hua
關鍵字: heat sink;LED;enhanced heat transfer;point-matching method;series truncation method
公開日期: 1-一月-2021
出版社: BEGELL HOUSE INC
卷: 28
期: 2
起(迄)頁: 19-40
來源出版物: JOURNAL OF ENHANCED HEAT TRANSFER
摘要: 
This study presented a two-dimensional heat transfer analysis of the light-emitting diode equipment's heat sink module under forced convection theoretically. The metal materials of the base and fins in the heat sink included Cu, Al, Al alloy, Mg, Zn, Fe, constantan, and stainless steel. The point-matching and series truncation methods were used to solve the heat-transfer problem. Due to the complexity of the system, the heat sink was divided into two regions, i.e., base and fin, and were solved individually. The temperature distribution of the heat sink module was then obtained by imposing continuity of temperature and heat flux at the interface between the two regions. The results showed that the material of the fins had little effect on heat-transfer rates, and the differences in mean temperatures of the heat sinks for different materials were not pronounced for a smaller Bi. In addition, when the base of the heat sink was made of aluminum, a 7.4-fold, a 5.6-fold, and a 0.7-fold increase in Q* for copper fins, iron fins, and stainless steel fins were obtained, as Bi was raised from 0.0005 to 0.005 for W = 0.5, T = 0.5, and L = 1.
URI: http://scholars.ntou.edu.tw/handle/123456789/17102
ISSN: 1065-5131
DOI: 10.1615/JEnhHeatTransf.2020036197
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