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Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/1946
Title: The use of surfactants and supercritical CO2 assisted processes in the electroless nickel plating of printed circuit board with blind via
Authors: Hung-Bin Lee 
Chen, K. L.
Su, J. W.
Lee, C. Y.
Issue Date: Feb-2020
Journal Volume: 241
Source: Materials Chemistry and Physics
URI: http://scholars.ntou.edu.tw/handle/123456789/1946
ISSN: 0254-0584
DOI: 10.1016/j.matchemphys.2019.122418
://WOS:000514749500082
Appears in Collections:光電與材料科技學系

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