The Stamping Method Utilizing a Double-Trough Die in Microforming to Enhance Formability

Abstract

Currently, the field of microgear manufacturing faces various processing challenges, particularly in terms of size reduction; these challenges increase the complexity and costs of manufacturing. In this study, a technique for microgear manufacturing is aimed at reducing subsequent processing steps and enhancing material utilization. This technique involves the use of trough dies with extrusion-cutting processing, which enables workpieces to undergo forming in a negative clearance state, thus reducing subsequent processing time for micro products. We conducted finite element simulations using microgear dies, measuring stress, velocity, and flow during the forming process of four types of dies-flat, internal-trough, external-trough, and double-trough dies. The results indicated that the buffering effect of the troughs reduced the rate of increase in the material's internal stress. In the cavity, the material experiences a significant increase in hydrostatic pressure, leading to the formation of a hydr ostatic pressure wall". This pressure barrier imposes substantial constraints on the flow of the material during dynamic processes making it difficult for the material to move into the remaining areas. This effectively enhances the blockage of material flow demonstrating the critical role of hydrostatic pressure in controlling material distribution and movement. In addition combining the characteristics of both into a double-trough die enhances the overall stability of forming velocity reduces forming load and energy consumption and maximizes material utilization. Results further revealed that microgears manufactured using double-trough dies exhibited defect-free surfaces with a dimensional error of less than 5 mu m and tolerances ranging from IT5 to IT6. Overall this study offers new insights into the traditional field of microgear manufacturing highlighting potential solutions for the challenges encountered in current microstamping processes