Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/3130

Title:	Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
Authors:	Yi-Ming Jen Wu, Y. L. Fang, C. K.
Issue Date:	Feb-2006
Journal Volume:	46
Journal Issue:	2-4
Source:	Microelectronics Reliability
URI:	http://scholars.ntou.edu.tw/handle/123456789/3130
ISSN:	0026-2714
DOI:	10.1016/j.microrel.2005.06.011 ://WOS:000235441100019
Appears in Collections:	機械與機電工程學系

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