http://scholars.ntou.edu.tw/handle/123456789/4485| Title: | Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration | Authors: | Ko, C. T. Yang, H. Lau, J. H. Li, M. Lin, C. Lin, J. W. Chen, T. Xu, I. Chang, C. L. Pan, J. Y. Wu, H. H. Yong, Q. X. Fan, N. Kuah, E. Li, Z. Tan, K. H. Cheung, Y. M. Ng, E. Wu Kai Hao, J. Beica, R. Lin, M. Chen, Y. H. Cheng, Z. Wee, K. S. Ran, J. Xi, C. Lim, S. P. Lee, N. C. Tao, M. Lo, J. Lee, R. S. W. |
Issue Date: | Sep-2018 | Journal Volume: | 8 | Journal Issue: | 9 | Source: | Ieee Transactions on Components Packaging and Manufacturing Technology | URI: | http://scholars.ntou.edu.tw/handle/123456789/4485 | ISSN: | 2156-3950 | DOI: | 10.1109/tcpmt.2018.2848665 |
| Appears in Collections: | 光電與材料科技學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.