Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/4488

Title:	Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Authors:	Lau, J. H. Li, M. Li, Q. M. Xu, I. Chen, T. Li, Z. Tan, K. H. Yong, Q. X. Cheng, Z. Wee, K. S. Beica, R. Ko, C. T. Lim, S. P. Fan, N. Kuah, E. Wu Kai Cheung, Y. M. Ng, E. Xi, C. Ran, J. Yang, H. Chen, Y. H. Lee, N. C. Tao, M. Lo, J. Lee, R.
Issue Date:	Jun-2018
Journal Volume:	8
Journal Issue:	6
Source:	Ieee Transactions on Components Packaging and Manufacturing Technology
URI:	http://scholars.ntou.edu.tw/handle/123456789/4488
ISSN:	2156-3950
DOI:	10.1109/tcpmt.2018.2814595 ://WOS:000434471600011
Appears in Collections:	光電與材料科技學系

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